Beryllium Copper Strip For Connectors
Grade Equivalents: UNS C17200 / CuBe2 / Alloy 25 / RWMA Class 4 / EN CW101C
Application Focus: High-Density Electronic Connectors, Terminal Blocks, IC Sockets, & Spring Pins
Executive Standards: ASTM B194, ASTM B248, SAE J463, ISO 5182 Specifications
Size Range: Thickness 0.05mm - 2.0mm, Width up to 300mm, Precision Slit Coils / Cut Strips
Temper Condition: Annealed (TB00), Pre-Rolled Tempers (H02/H04), or Precipitation Heat-Treated (TF00)
Core Purpose: High-Reliability Electrical Interconnection Combined with Ultimate Spring Resilience & Conductivity
Quality Assurance: ISO9001:2015, RoHS Compliant, MTC 3.1 Certified
Description
Beryllium Copper Strip For Connectors | C17200 High-Strength Spring Contact Material for Precision Electronic Applications
For engineers creating high-density electronic connections, IC sockets, terminal blocks, and spring pins, Beryllium Copper Strip For Connectors is the recommended spring contact material. This strip offers a performance level that brass and phosphor bronze just cannot equal, with tensile strength reaching 1130–1320 MPa and electrical conductivity of 22–25% IACS.
It is made in accordance with ASTM B194 and ISO 5182 standards and comes in precision split coils or cut strips with thicknesses ranging from 0.05 mm to 2.0 mm and widths up to 300 mm. With more than 25 years of specialist experience with beryllium copper, Dongguan Jiaye Dingsheng Precision Casting & Forging Co., Ltd. has been producing copper alloy goods since 1997.
What Makes This Material Different From Standard Copper Alloys?
Over time, phosphor bronze and brass lose contact force, particularly in temperatures higher than 75°C. This is directly resolved by beryllium copper.
In small connection designs, its yield strength of 950–1150 MPa permits maximal elastic deflection without irreversible deformation. After thousands of cycles of insertion and withdrawal, the strip regains its original form.
Under thermal load, standard copper alloys experience stress relaxation. The majority of connector-grade phosphor bronze cannot meet the requirement that this Beryllium Copper Strip For Connectors maintain steady contact force even inside high-density electronic packages operating at increased temperatures.
Material Specifications
| Parameter | Value |
|---|---|
| Grade | UNS C17200 / CuBe2 / Alloy 25 |
| Standard | ASTM B194, ASTM B248, SAE J463, ISO 5182 |
| Beryllium Content | 1.80 – 2.00% |
| Co + Ni (min) | 0.20% |
| Base Metal | Copper Balance |
| Thickness Range | 0.05 mm – 2.0 mm |
| Width (max) | Up to 300 mm |
| Temper Conditions | TB00 (Annealed), H02/H04 (Pre-Rolled), TF00 (Aged) |
| Tensile Strength (Aged) | 1130 – 1320 MPa |
| Yield Strength (Aged) | 950 – 1150 MPa |
| Hardness (Aged) | 36 – 42 HRC / 350 – 420 HV |
| Electrical Conductivity | 22 – 25% IACS |
| Thermal Conductivity | 105 W/m·K |
| Elastic Modulus | ~131 GPa |
| Magnetic Permeability | < 1.001 (Non-Magnetic) |
| Certifications | ISO 9001, RoHS, REACH, MTC EN 10204 3.1 |
Key Application Areas
This strip is designed to be stamped and formed into precise connection parts. It is compatible with many different applications.
High-Density Electronic connections: These connections are perfect for backplane connectors and board-to-board interfaces where signal integrity and contact retention are important due to their high yield strength and 22–25% IACS conductivity.
IC Sockets & Spring Pins: Under thousands of repeated contact cycles, the strip's elastic modulus of around 131 GPa produces a constant spring force in test sockets and burn-in connections.
Terminal Blocks & Automotive Connectors: In engine compartment and power distribution connectors where temperatures are constantly changing, thermal stability up to 150–200°C minimizes contact force loss.
Aerospace Interconnects: Sensitive avionics and navigation systems are protected from electromagnetic interference by non-magnetic behavior (permeability < 1.001).
Temper Selection Guide for Connector Fabrication
Selecting the right temper before forming is critical. Forming after full age hardening can cause cracking due to reduced elongation.
TB00 (Solution Annealed): Best for complex 3D bending and deep-draw stamping. Parts are formed first, then precipitation hardened at 315°C–325°C for 2–3 hours to reach final strength.
H02 / H04 (Pre-Rolled / Mill Hardened): Suitable for applications requiring intermediate strength without additional heat treatment. Reduces processing steps for simpler geometries.
TF00 (Precipitation Hardened): Maximum hardness (36–42 HRC) and conductivity. Used when parts are supplied in finished condition, ready for plating and assembly.
Precipitation hardening significantly increases both hardness and conductivity simultaneously — a behavior unique to beryllium copper among spring contact materials.
Surface Finishing & Plating Compatibility
The strip comes with stable surface roughness to ensure plating adhesion. It supports gold, silver, nickel and tin electroplating. Reasonable plating combinations can improve contact stability and solderability, adapting to SMT and through-hole assembly processes.
Quality Control Process
We implement three-stage inspection: OES composition verification before production, real-time monitoring of rolling and heat treatment parameters during processing, and final dimensional, hardness and conductivity testing. All shipments are equipped with complete EN 10204 3.1 test reports with full traceability.
Customization & Supply Options
We provide standard stock Beryllium Copper Strip For Connectors with 3–5 days delivery and 24-hour quotation service. Custom size, tolerance, temper and surface finish are available to match stamping production needs. We support full international logistics and customs document services.
FAQ
Q1: Why choose this beryllium copper over phosphor bronze?
A1: It has higher yield strength and better high-temperature stress relaxation resistance, keeping stable contact force for long-term cyclic use.
Q2: Is the material export compliant?
A2: Solid strip products meet RoHS and REACH standards. Only dust-generating processing requires targeted safety protection.
Q3: Should forming be done before or after aging?
A3: Form with TB00 or H02/H04 temper first. Forming after full aging may cause material cracking.
Q4: How does aging affect material performance?
A4: Low-temperature aging improves both hardness and conductivity, reaching the standard parameters required for connector production.
Q5: Can custom thickness tolerances be provided?
A5: Standard tolerances follow ASTM B194, and customized precision tolerances are available on request.
Q6: How to store the strip?
A6: Store in cool and dry environment with anti-tarnish packaging to avoid surface oxidation.
Contact Us
Submit your drawings and technical parameters to js01@jstongcai.com.cn. Our professional team will provide targeted solutions and formal quotes within 24 hours for your Beryllium Copper Strip For Connectors procurement projects.
